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SHEN ZHEN XIN MING HONG ELECTRONIC CO.,LIMITED
SHEN ZHEN XIN MING HONG ELECTRONIC CO.,LIMITED
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1.9MM ROUND SUBMINIATURE LEAD LEDS, SMD LED,BUTTERFLY LED

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SHEN ZHEN XIN MING HONG ELECTRONIC CO.,LIMITED
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1.9MM ROUND SUBMINIATURE LEAD LEDS, SMD LED,BUTTERFLY LED

Brand Name : XIN MING HONG

Model Number : MH-9521QRC-001

Certification : ROHS certification

Place of Origin : CHINA

MOQ : 100000pcs

Price : USD 0.02/PCS

Payment Terms : T/T

Supply Ability : 50000000 /month

Delivery Time : 3-5 working days

Packaging Details : Products are packed in one bag of 1000pcs(one taping reel)

Color : Red

Package Size : 1.6x0.8x0.6mm(0603)

Forward Voltage : 1.8-2.4v

Luminous Intensity : 150-200mcd

Forward Current : 20MA

Domint Wave Length : 620-630nm

Viewing Angle : 25 deg

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SHEN ZHEN XIN MING HONG ELECTRONIC CO.,LIMITED professional manufacture SMD LED for 10 years with good quality and best performance. Our products include 0603 0805 1206 3528 5050 etc.

1.9mm Round Subminiature Lead LEDS

Features:

  • (1)suitable for all SMT asembly methods.
  • (2)compatible with infrared and vapor phase reflow solder process.
  • (3)compatible with automatic placement equipment.
  • (4)This product doesn't contain restriction substance,comply ROHS standard.

Applications:

  • Turn singals
  • Status indicators:comsumer & industrial
  • Backlighting:LCDS,Key pads adverstising
  • General use

Package Dimensions:

Electrical and optical characteristics(Ta=25Electrical and optical characteristics(Ta=25C)Electrical and optical characteristics(Ta=25C)Electrical and optical characteristics(Ta=25C)C)

Parameter Symbol Min. Typ. Max. Unit Test Condition
Luminous Intensity Iv 150 - 200 mcd If=20mA (Note 1)
Viewing Angle 2θ1/2 --- 25 --- Deg (Note 2)
Wave length nm 620 625 630 nm IF=20mA (Note 3)
Forward Voltage VF 1.8 2.0 2.4 V IF=20mA
Reverse Current IR --- --- 100 µA VR=5V

Soldering

  • Reflow soldering

Preheating:140°C-160°C±5°C,within 2 minutes.

Operation heating:235°C(MAX.) within 10 seconds.

Gradual Cooling(Avoid quenching)

Preheating:140°C-160°C±5°C,within 2 minutes.

Operation heating:235°C(MAX.) within 10 seconds.

Gradual Cooling(Avoid quenching)

  • Dip soldering(wave soldering)

Preheating:120°C-150°C, within 120-180 sec

Operation heating:245°C±5°C within 5 sec.260°C(MAX)

Gradual cooling(Avoid quenching)


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